Organic light emitting display device

ABSTRACT

An organic light emitting display device includes a flexible display panel having a display region where a plurality of pixels are disposed and a pad region where pad electrodes that are electrically connected to an external device are disposed, the pad region being located at a side of the display region, the display panel being configurable to have a curved shape where a flexible portion of the display region is bent, an upper structure in the display region of the display panel, and a lower protection film on a lower surface of the display panel, and including an adhesive layer and a protection layer. The adhesive layer is in direct contact with the lower surface of the display panel, and includes an antistatic material. The protection layer is disposed under the adhesive layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2016-0103290, filed on Aug. 12, 2016, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND FIELD

The invention relates generally to organic light emitting displaydevices, and, more particularly, to organic light emitting displaydevices that are flexible and resistant to damage or defects due tostatic electricity.

DISCUSSION OF THE BACKGROUND

Flat panel display (FPD) devices are widely used as a display device ofan electronic device because the FPD device is lightweight and thincompared to a cathode-ray tube (CRT) display device. Typical examples ofthe FPD devices are a liquid crystal display (LCD) device and an organiclight emitting display (OLED) device.

Recently, a flexible OLED device has been developed that is capable ofbending or folding a portion of a display device by including lower andupper substrates which have flexible materials. For example, the lowersubstrate included in the display panel may be formed of a flexiblesubstrate, and the upper substrate included in the display panel mayhave a thin film encapsulation structure. In addition, the flexibledisplay device may further include an upper structure that is located onan upper surface of the display panel and a lower protection film thatis located on a lower surface of the display panel. Here, the lowerprotection film may include an adhesive layer and a protection film thatprotects the adhesive layer.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventiveconcepts, and, therefore, it may contain information that does not formthe prior art that is already known in this country to a person ofordinary skill in the art.

SUMMARY

Applicants have discovered that when the lower protection film of aflexible OLED adheres to the lower surface of the display panel, it mayadhere after the protection film has become detached from the adhesivelayer. In this case, static electricity may be generated as theprotective film is detached from the adhesive layer, and the flexibledisplay device may be damaged by the static electricity. Additionally,the presence of non-uniform static electric may cause a displayed imageto be non-uniform.

One or more exemplary embodiments of the invention provide an organiclight emitting display device having an adhesive layer that includes anantistatic material having a surface resistance that enables staticelectric charges to achieve a uniform distribution in the adhesive layerand/or migrate to a grounded process device. Accordingly, theperformance of the device may be improved by reducing or eliminatingsome or all of the problems caused by static electricity. Further, aweight ratio the antistatic material with respect to the total weight ofthe adhesive layer may be in a range that enables some or all ofproblems caused by the static electricity to be overcome without addingmuch weight to the device.

Additional aspects or benefits will be set forth in the detaileddescription which follows, and, in part, will be apparent from thedisclosure, or may be learned by practice of the inventive concepts.

According to a one aspect of the invention, an organic light emittingdisplay (OLED) device includes a flexible display panel, an upperstructure, and a lower protection film. The display panel has a displayregion where a plurality of pixels are disposed and a pad region wherepad electrodes that are electrically connected to an external device aredisposed. The pad region is located at a side of the display region. Thedisplay panel is configurable to have a curved shape where a flexibleportion of the display region is bent. The upper structure is disposedin the display region of the display panel. The lower protection film isdisposed on a lower surface of the display panel, and includes anadhesive layer and a protection layer. The adhesive layer is in directcontact with the lower surface of the display panel, and includes anantistatic material. The protection layer is disposed under the adhesivelayer.

In example embodiments, the display region may have a first widthextending in a first direction, and the pad region may have a secondwidth extending in the first direction when viewed in a plan view of theOLED device. The second width may be less than the first width.

In example embodiments, the display region may include a firstsub-display region having opposed lateral portions, second and thirdsub-display regions, a fourth sub-display region, and a fifthsub-display region. The first sub-display region may be located in acenter of the display region. The second sub-display region may belocated at one of the opposed lateral portions of the first sub-displayregion and the third sub-display region may be located at the otheropposed lateral portion. The second and third sub-display regions may beconfigured to have a shape that is bent on an axis with respect to asecond direction. The second direction may be perpendicular to the firstdirection. The fourth sub-display region may be located adjacent to thesecond sub-display region, and may extend in a third direction that isorthogonal to both the first direction and the second direction. Thefifth sub-display region may be located adjacent to the thirdsub-display region, and may extend in the third direction.

In example embodiments, the second and fourth sub-display regions andthe third and fifth sub-display regions may be symmetrical to each otherwith respect to the first sub-display region.

In example embodiments, the display region may include a light emittingregion configured to emit light and a peripheral region surrounding thelight emitting region. The first sub-display region, the secondsub-display region, and the third sub-display region may be located inthe light emitting region, and the fourth sub-display region and thefifth sub-display region may be located in the peripheral region.

In example embodiments, the lower protection film may be disposed on aportion of the lower surface of the display panel that is located in thefirst, second, third, fourth, and fifth sub-display regions or onsubstantially the entire lower surface of the display panel that islocated in the first, second, third, fourth, and fifth sub-displayregions.

In example embodiments, a neutral plane of the lower protection film,the display panel, and the upper structure in the second and thirdsub-display regions are located within the display panel.

In example embodiments, a thickness of the adhesive layer of the lowerprotection film may be in a range between about 11 and about 15micrometers, and a thickness of the protection layer of the lowerprotection film may be in a range between about 74 and about 76micrometers.

In example embodiments, a plurality of wirings may be disposed in theperipheral region, and the plurality of wirings may electrically connectthe pad electrodes and the pixels.

In example embodiments, the pad region may include a bending regionlocated in a first portion of the pad region that is adjacent to thedisplay region and a pad electrode region where the pad electrodes aredisposed in a second portion of the pad region.

In example embodiments, the OLED device may further include a bendingprotection layer and connection electrodes. The bending protection layermay be disposed in a portion of the display region, the bending region,and a portion of the pad electrode region. The connection electrodes maybe disposed between the bending protection layer and the display panel,and may electrically connect the pixels and the pad electrodes.

In example embodiments, the lower protection film may expose a portionof the lower surface of the display panel that is located in the bendingregion.

In example embodiments, the lower protection film may include a firstlower protection film pattern and a second lower protection filmpattern. The first lower protection film pattern may be disposed in thedisplay region. The second lower protection film pattern may be disposedin the pad electrode region of the pad region such that the portion ofthe lower surface of the display panel that is located in the bendingregion is exposed.

In example embodiments, the first lower protection film pattern and thesecond lower protection film pattern may be spaced apart from eachother.

In example embodiments, the bending region may be bent on an axis withrespect to the first direction, and the second lower protection filmpattern may be disposed on a lower surface of the first lower protectionfilm pattern.

In example embodiments, a bending radius of the bending region may beless than a bending radius of a portion of the display region where thedisplay region is bent.

In example embodiments, the lower protection film may define a groove inthe bending region.

In example embodiments, the adhesive layer included in the lowerprotection film may be entirely disposed on the lower surface of thedisplay panel. The protection layer included in the lower protectionfilm may include a first protection layer and a second protection layer.The first protection layer may be disposed in the display region. Thesecond protection layer may be disposed in the pad region. The firstprotection layer and the second protection layer may define an openingexposing a lower surface of the adhesive layer located in the bendingregion. The first protection layer and the second protection layer maybe spaced apart from each other on the lower surface of the adhesivelayer.

In example embodiments, each of the pixels included in the display panelmay include a substrate on the lower protection film, a semiconductorelement on the substrate, a lower electrode on the semiconductorelement, a light emitting layer on the lower electrode, an upperelectrode on the light emitting layer, and a thin film encapsulationstructure on the upper electrode.

In example embodiments, the semiconductor element may include an activelayer, a gate insulation layer, a gate electrode, an insulatinginterlayer, and source and drain electrodes. The active layer may bedisposed on the substrate. The gate insulation layer may be disposed onthe active layer. The gate electrode may be disposed on the gateinsulation layer. The insulating interlayer may be disposed on the gateelectrode, and the gate insulation layer and the insulating layer maydefine an opening that exposes an upper surface of the substrate that islocated in the bending region. The source and drain electrodes may bedisposed on the insulating interlayer.

In example embodiments, the upper structure may include a touch screenelectrode layer and a polarizing layer on the thin film encapsulationstructure.

In example embodiments, the polarizing layer may be disposed on thetouch screen electrode layer.

In example embodiments, the touch screen electrode layer may be disposedon the polarizing layer.

In example embodiments, the lower protection film may further include anantistatic layer under the protection layer.

In example embodiments, a thickness of the protection layer may begreater than a thickness of the adhesive layer, and the thickness of theadhesive layer may be greater than a thickness of the antistatic layer.

In example embodiments, a surface resistance of an upper surface of thelower protection film that is in direct contact with the display panelmay be less than about ×10¹¹ ohm/sq.

In example embodiments, a weight ratio the antistatic material based ona total weight of the adhesive layer may be in a range between about 1wt % and about 3 wt %.

In example embodiments, the protection layer may further include a lightblocking material.

In example embodiments, the light blocking material may include at leastone material selected from the group consisting of carbon black,titanium nitride oxide, titanium black, phenylene black, aniline black,cyanine black, and nigrosine acid black.

According to another aspect of the invention, an OLED device includes adisplay panel, an upper structure, and a lower protection film. Thedisplay panel has a display region where a plurality of pixels aredisposed and a pad region where pad electrodes that are electricallyconnected to an external device are disposed. The pad region is locatedat a first side of the display region. The display panel is configurableto have a curved shape where a flexible portion of the display region isbent. The upper structure is disposed in the display region of thedisplay panel. The lower protection film is disposed on a lower surfaceof the display panel, and includes an adhesive layer and a protectionlayer. The adhesive layer is in direct contact with the lower surface ofthe display panel, and includes an antistatic material. The protectionlayer is disposed under the adhesive layer. The pad region includes abending region located in a first portion of the pad region that isadjacent to the display region and a pad electrode region where the padelectrodes are disposed in a second portion of the pad region. The lowerprotection film includes a first lower protection film pattern and asecond lower protection film pattern. The first lower protection filmpattern is disposed in the display region. The second lower protectionfilm pattern is disposed in the pad electrode region of the pad regionsuch that the portion of the lower surface of the display panel that islocated in the bending region is exposed. The antistatic material isincluded in the first lower protection film pattern, and the secondlower protection film pattern does not include the antistatic material.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concepts, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concepts, and, together with thedescription, serve to explain principles of the inventive concepts.

FIG. 1A is a plan view of a first embodiment of an organic lightemitting display (OLED) device constructed according to the principlesof the invention in which the OLED has a flat shape before any bendingof the display region;

FIG. 1B is a plan view of a peripheral region included in the OLEDdevice of

FIG. 1A illustrating the OLED after a portion of the display region hasbeen bent;

FIG. 1C is a block diagram of an external device electrically connectedto the OLED device of FIG. 1A;

FIG. 2A is a cross-sectional view taken along a line I-I′ of FIG. 1A;

FIG. 2B is a cross sectional view illustrating part of the structure ofthe display panel of FIG. 2A;

FIG. 2C is a cross sectional view illustrating a first example of a bentportion of the display panel of FIG. 2A;

FIG. 2D is a cross sectional view illustrating a second example of abent portion of the display panel of FIG. 2A;

FIG. 2E is a cross sectional view illustrating a third example of a bentportion of the display panel of FIG. 2A;

FIG. 2F is a cross sectional view illustrating a fourth example of abent portion of the display panel of FIG. 2A;

FIG. 3A is a cross-sectional view taken along a line II-IF of FIG. 1A;

FIG. 3B is a cross-sectional view illustrating a bent shape of the OLEDdevice of FIG. 3A;

FIG. 4A is an enlarged cross-sectional view of region ‘A’ of FIG. 3A;

FIG. 4B is an enlarged cross-sectional view of region ‘B’ of FIG. 3A;

FIGS. 5A, 5B, 5C, 6, 7, and 8 are cross-sectional views illustratingvarious stages of an exemplary method of manufacturing an OLED deviceaccording to the principles of the invention;

FIG. 9 is a cross-sectional view of a second embodiment of an OLEDdevice constructed according to the principles of the invention;

FIG. 10 is a cross-sectional view of a third embodiment of an OLEDdevice constructed according to the principles of the invention;

FIG. 11 is a cross-sectional view of a fourth embodiment of an OLEDdevice constructed according to the principles of the invention; and

FIG. 12 is a cross-sectional view of a fifth embodiment of an OLEDdevice constructed according to the principles of the invention.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers, and/or sections, theseelements, components, regions, layers, and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the drawings are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

Hereinafter, embodiments constructed according to the principles of theinvention will be explained in detail with reference to the accompanyingdrawings.

Referring to FIGS. 1A, 1B, and 1C, an OLED device 100 may include adisplay panel, an upper structure, a lower protection film, etc., aswill be described in greater detail below.

The display panel may have a display region 10 and a pad region 20. Aplurality of pixels P may be disposed in the display region 10, and thepad region 20 may be located in a first side of the display region 10. Awidth of the pad region 20 may be less than a width of the displayregion 10, and pad electrodes 470 that are electrically connected to anexternal device 101 may be disposed in the pad region 20. The displayregion 10 may have a first width W1 extending in a first direction D1that is parallel to an upper surface of the OLED device 100 when viewedin a plan view of the OLED device 100. In addition, the pad region 20may have a second width W2 extending in the first direction D1 whenviewed in a plan view of the OLED device 100, and the second width W2may be less than the first width W1.

The display region 10 may include a light emitting region 30 where alight is emitted and a peripheral region 40 that surrounds the lightemitting region 30. The pixels P emitting a light may be disposed in thelight emitting region 30, and a plurality of wirings may be disposed inthe peripheral region 40. The wirings may be electrically connected tothe pad electrodes 470 and the pixels P. For example, the wirings mayinclude data signal wirings, scan signal wirings, light emission signalwirings, power supply voltage wirings, and so on. In addition, a scandriver, a data driver, and other components may be disposed in theperipheral region 40.

The width of the peripheral region 40 surrounding the light emittingregion 30 of FIG. 1B may be the same on each side of the light emittingregion 30; or, the width of the peripheral region 40 may be different ondifferent sides of the light emitting region. For example, theperipheral region 40 may include a first region extending in the firstdirection D1 and a second region extending in a second direction D2 thatis perpendicular to the first direction D1. In other words, the firstregion of the peripheral region 40 may be located adjacent to the top ofthe display panel 200 and a bending region 50, and the second region ofthe peripheral region 40 may be located in both lateral portions of thedisplay panel 200. Here, a width extending in the first direction D1 ofthe second region may be relatively less than a width extending in thesecond direction D2 of the first region.

The pad region 20 may include a bending region 50 located in a portionof the pad region 20 that is adjacent to the display region 10 and a padelectrode region 60 located in a remaining portion of the pad region 20.For example, the bending region 50 may be interposed between the displayregion 10 and the pad electrode region 60, and the pad electrodes 470may be disposed in the pad electrode region 60. As the bending region 50is bent, the pad electrode region 60 may be located on a lower surfaceof the OLED device 100. As described in further detail below, the OLEDdevice 100 may further include a bending protection layer and connectionelectrodes. The bending protection layer may be disposed in a portion ofthe display region 10, the bending region 50, and a portion of the padelectrode region 60 on the display panel as will be described in greaterdetail below. The connection electrodes may be disposed between thebending protection layer and the display panel, and may be electricallyconnected to the wirings and the pad electrodes 470. As illustrated inFIG. 1C, the pixels P disposed in the light emitting region 30 and anexternal device 101 that is electrically connected to the pad electrodes470 may be electrically connected through the connection electrodesdisposed in the bending region 50 and the wirings disposed in theperipheral region 40. For example, the external device 101 and the OLEDdevice 100 may be electrically connected through a flexible printedcircuit board (FPCB). The external device 101 may provide a data signal,a scan signal, a light emission signal, a power supply voltage, and soon, to the OLED device 100. In addition, a driving integrated circuitmay be mounted (e.g., installed) in the FPCB. In some exampleembodiments, the driving integrated circuit may be mounted in thedisplay panel 200 that is located adjacent to the pad electrodes 470.

The upper structure may be disposed in the display region 10 on thedisplay panel. As will be described in greater detail below, the upperstructure may include a touch screen electrode layer, a polarizinglayer, and so on. In example embodiments, the touch screen electrodelayer may be disposed on the display panel, and the polarizing layer maybe disposed on the touch screen electrode layer.

As described below, the lower protection film may be disposed on a lowersurface of the display panel, and may include an adhesive layer and aprotection layer. The adhesive layer may be in direct contact with alower surface of the display panel, and may include an antistaticmaterial. In addition, the protection layer may be disposed under theadhesive layer.

Because the OLED device 100 includes an adhesive layer having antistaticmaterial, the OLED device 100 may protect the display panel from astatic electricity.

Referring to FIGS, 1A, 2A, and 2B, an upper structure 400 may bedisposed in a display region 10 on a display panel 200 included in anOLED device 100, and a first lower protection film pattern 351 includedin a lower protection film may be disposed on a lower surface of thedisplay panel 200. The upper structure 400 may include a touch screenelectrode layer 410 and a polarizing layer 430. In addition, the firstlower protection film pattern 351 may include a first protection layer301 and a first adhesive layer 302. The touch screen electrode layer 410may be disposed on the display panel 200, and the polarizing layer 430may be disposed on the touch screen electrode layer 410. In addition,the first adhesive layer 302 may be disposed on a lower surface of thedisplay panel 200, and the first protection layer 301 may be disposedunder the first adhesive layer 302.

As illustrated in FIG. 2B, the display panel 200 may have the displayregion 10, and the display region 10 may include a light emitting region30 and a peripheral region 40. The display region 10 may include a firstsub-display region 31, a second sub-display region 32, a thirdsub-display region 33, a fourth sub-display region 34, and a fifthsub-display region 35. For example, the first sub-display region 31, thesecond sub-display region 32, and the third sub-display region 33 may beincluded in the light emitting region 30, and the fourth sub-displayregion 34 and the fifth sub-display region 35 may be included in theperipheral region 40. The first sub-display region 31 may be located inthe center of the display region 10, and the second sub-display region32 and the third sub-display region 33 may be located in lateralportions of the first sub-display region 31. Each of the secondsub-display region 32 and the third sub-display region 33 may have ashape that is bent on an axis with respect to a second direction D2which may be perpendicular to a first direction D1. The fourthsub-display region 34 may be located adjacent to the second sub-displayregion 32, and may extend in a third direction D3 that may be verticalto the first and second directions D1 and D2. The fifth sub-displayregion 35 may be located adjacent to the third sub-display region 33,and may extend in the third direction D3. In example embodiments, thesecond and fourth sub-display regions 32 and 34 and the third and fifthsub-display regions 33 and 35 may be symmetrical to each other withrespect to the first sub-display region 31. The first lower protectionfilm pattern 351 may be partially or entirely disposed on a lowersurface of the display panel 200 that may be located in the first,second, third, fourth, and fifth sub-display regions 31, 32, 33, 34, and35.

Referring to FIGS. 2C, 2D, 2E and 2F, variously shaped patterns may beformed by removing at least a portion of a lower protection film 300 ina portion where the display region 10 is bent. These patterns may beformed by alternating convex projections separated by concave spacesbetween the convex projections, but other shape projections may also beemployed. In other words, the lower protection film 300 may have thevariously shaped patterns defined therein. For example, as illustratedin FIGS. 2C and 2E, the patterns may be formed by removing a portion ofthe first protection layer 301. Alternatively, as illustrated in FIGS.2D and 2F, the patterns may be formed by partially or completelyremoving the first protection layer 301 and the first adhesive layer 302such that the display panel 200 is exposed in a particular locationwhere the display region 10 is bent. Examples of the shape of thepatterns as depicted in FIGS. 2C, 2D, and 2E include a trapezoidal shapeand a tetragonal shape. It should be apparent that the shapes formed bythe removal of the portion of the lower protection film 300 may bedifferent in other embodiments. Thus, in other embodiments, the shape ofthe patterns may vary from the shapes depicted in FIGS. 2C, 2D, 2E and2F.

Referring to FIGS. 1A, 3A, and 3B, the OLED device 100 may include adisplay panel 200, a lower protection film 300, an upper structure 400,a bending protection layer 460, a pad electrode 470, and so on. Here,the lower protection film 300 may include a first lower protection filmpattern 351 and a second lower protection film pattern 352. In addition,the first lower protection film pattern 351 may include a firstprotection layer 301 and a first adhesive layer 302; and, the secondlower protection film pattern 352 may include a second protection layer303 and a second adhesive layer 304. Further, the upper structure 400may include a polarizing layer 430 and a touch screen electrode layer410.

As described above, the display panel 200 may have a display region 10and a pad region 20. The display region 10 may include a light emittingregion 30 and a peripheral region 40; and, the pad region 20 may includea bending region 50 and a pad electrode region 60.

Pixels P where a light is emitted may be disposed in the light emittingregion 30; and, a plurality of wirings may be disposed in the peripheralregion 40. The wirings may be electrically connected to the padelectrode 470 and the pixels P.

The bending region 50 of the pad region 20 may be interposed between thepad electrode region 60 and the peripheral region 40 of the displayregion 10, and the pad electrode 470 may be disposed in the padelectrode region 60.

Referring to FIG. 3B, as the bending region 50 is bent, the padelectrode region 60 may be located on a lower portion of the OLED device100. For example, the bending region 50 may be bent on an axis withrespect to a first direction D1; and, the second lower protection filmpattern 352 may be disposed on a lower surface of the first lowerprotection film pattern 351. In addition, a bending radius of thebending region 50 may be less than a bending radius of a portion havinga shape where the display region 10 is bent. That is, the portion wherethe display region 10 is bent has a gradual slope whereas the bendingregion 50 may have a relatively steep slope. Alternatively, after thebending region 50 is bent, an adhesive tape may be interposed betweenthe second lower protection film pattern 352 and the first lowerprotection film pattern 351. In this case, the second lower protectionfilm pattern 352 and the first lower protection film pattern 351 may befixed by the adhesive tape. A thickness of the adhesive tape may beidentical to or greater than a thickness of the lower protection film300. In addition, the adhesive tape may absorb shock. For example, theadhesive tape may include urethane, rubber, and/or the like.

Referring again to FIGS. 1A and 3A, the upper structure 400 may bedisposed in the display region 10 on the display panel 200. The touchscreen electrode layer 410 may be disposed on the display panel 200;and, the polarizing layer 430 may be disposed on the touch screenelectrode layer 410.

The lower protection film 300 may be disposed on a lower surface of thedisplay panel 200. In example embodiments, the lower protection film 300may include the first lower protection film pattern 351 that is disposedin the display region 10 and the second lower protection film pattern352 that is disposed in the pad electrode region 60 such that a lowersurface of the display panel 200 located in the bending region 50 isexposed. In other words, the lower protection film 300 may have anopening exposing a lower surface of the display panel 200 in the bendingregion 50. In addition, the first adhesive layer 302 and the secondadhesive layer 304 may be in direct contact with a lower surface of thedisplay panel 200, and may include antistatic materials. Further, eachof the first protection layer 301 and the second protection layer 303may be disposed under the first adhesive layer 302 and the secondadhesive layer 304, respectively.

The bending protection layer 460 may be disposed in a portion of thedisplay region 10, the bending region 50, and a portion of the padelectrode region 60 on the display panel 200. Connection electrodes maybe disposed between the bending protection layer 460 and the displaypanel 200. The connection electrodes may be electrically connected tothe wirings disposed in the peripheral region 40 and the pad electrode470. Pixels P disposed in the light emitting region 30 and an externaldevice 101 that is electrically connected to the pad electrode 470 maybe electrically connected through the connection electrodes disposed inthe bending region 50 and through the wirings disposed in the peripheralregion 40. A thickness of the bending protection layer 460 may bedetermined such that a neutral plane in the bending region 50 is locatedwithin a portion where the connection electrodes are disposed. Forexample, when the bending region 50 is bent, the connection electrodesmight not be broken (or, cut) because the neutral plane of the bendingregion 50 may be located within the portion where the connectionelectrodes are disposed.

The pad electrode 470 may be disposed in the pad electrode region 60 onthe display panel 200. The pad electrode 470 may be electricallyconnected to the external device 101, and may provide a data signal, ascan signal, a light emission signal, a power supply voltage, and so on,which may be applied from the external device 101, to the pixels P.

The upper structure 400 may include the touch screen electrode layer 410and the polarizing layer 430; and, in some embodiments, the upperstructure 400 may further include a plurality of layers.

Referring to FIGS. 4A and 4B, an OLED device 100 may include a displaypanel 200, a lower protection film 300, an upper structure 400, abending protection layer 460, and so on. The display panel 200 mayinclude a substrate 110, a semiconductor element 250, a planarizationlayer 270, a pixel defining layer 310, a lower electrode 290, a lightemitting layer 330, an upper electrode 340, and a thin filmencapsulation (TFE) structure 450. In addition, the upper structure 400may include a touch screen electrode layer 410 and a polarizing layer430. Further, the semiconductor element 250 may include an active layer130, a gate insulation layer 150, a gate electrode 170, an insulatinginterlayer 190, a source electrode 210, and a drain electrode 230; and,the TFE structure 450 may include first TFE layer 451, a second TFElayer 452, and a third TFE layer 453.

When the OLED device 100 includes the flexible substrate 110 and the TFEstructure 450, the OLED device 100 may serve as a flexible displaydevice.

The substrate 110 may be provided. The substrate 110 may includetransparent materials or opaque materials. The substrate 110 may beformed of a flexible transparent material such as a flexible transparentresin substrate (e.g., a polyimide substrate). For example, thepolyimide substrate may include a first polyimide layer, a first barrierfilm layer, a second polyimide layer, a second barrier film layer, andso on. Because the polyimide substrate is relatively thin and flexible,the polyimide substrate may be disposed on a rigid glass substrate tohelp support the formation of the semiconductor element 250 and thelight emitting structure (e.g., the lower electrode 290, the lightemitting layer 330, the upper electrode 340, and so on). That is, thesubstrate 110 may have a structure in which the first polyimide layer,the first barrier film layer, the second polyimide layer, and the secondbarrier film layer are stacked on the rigid glass substrate. Inmanufacturing the OLED device 100, after an insulating layer (e.g., abuffer layer) is provided on the second barrier layer of the polyimidesubstrate, the semiconductor element 250 and the light emittingstructure may be disposed on the insulating layer. After thesemiconductor element 250 and the light emitting structure are formed onthe insulating layer, the rigid glass substrate on which the polyimidesubstrate is disposed may be removed. It may be difficult to directlyform the semiconductor element 250 and the light emitting structure onthe polyimide substrate when the polyimide substrate is relatively thinand flexible. Accordingly, the semiconductor element 250 and the lightemitting structure may be formed on the polyimide substrate and therigid glass substrate, and then the polyimide substrate may serve as thesubstrate 110 of the OLED device 100 after the removal of the rigidglass substrate. Alternatively, the substrate 110 may include a quartzsubstrate, a synthetic quartz substrate, a calcium fluoride substrate, afluoride-doped quartz substrate, a sodalime glass substrate, anon-alkali glass substrate and so on.

A buffer layer may be disposed on the substrate 110. The buffer layermay be disposed on a part of or the entire substrate 110. The bufferlayer may prevent the diffusion of metal atoms and/or impurities fromthe substrate 110 into the semiconductor element 250. Additionally, thebuffer layer may control a rate of heat transfer in a crystallizationprocess for forming the active layer 130, thereby obtaining asubstantially uniform active layer 130. Furthermore, the buffer layermay improve a surface flatness of the substrate 110 when a surface ofthe substrate 110 is relatively irregular. Depending on the form of thesubstrate 110, at least two buffer layers may be provided on thesubstrate 110, or, alternatively, the buffer layer might be omitted. Thebuffer layer may include silicon compound, metal oxide, and so on.

The semiconductor element 250 may be disposed on the substrate 110. Theactive layer 130 may be disposed on the substrate 110. The active layer130 may include an oxide semiconductor, an inorganic semiconductor(e.g., amorphous silicon, polysilicon, and/or the like), an organicsemiconductor, and so on.

The gate insulation layer 150 may be disposed on the active layer 130.The gate insulation layer 150 may cover the active layer 130, and may bedisposed on the substrate 110. For example, the gate insulation layer150 may sufficiently cover the active layer 130 on the substrate 110,and may have a substantially level surface without a step around theactive layer 130. Alternatively, the gate insulation layer 150 may coverthe active layer 130, and may be disposed as a substantially uniformthickness along a profile of the active layer 130. The gate insulationlayer 150 may include an opening that exposes an upper surface of thesubstrate 110. The upper surface of the substrate 110 may be located ina portion of the peripheral region 40, the bending region 50, and aportion of pad electrode region 60. The gate insulation layer 150 mayinclude silicon compound, metal oxide, and so on. For example, the gateinsulation layer 150 may include silicon oxide (SiOx), silicon nitride(SiNx), silicon oxynitride (SiOxNy), silicon oxycarbide (SiOxCy),silicon carbon nitride (SiCxNy), aluminum oxide (AlOx), aluminum nitride(AlNx), tantalum oxide (TaOx), hafnium oxide (HfOx), zirconium oxide(ZrOx), titanium oxide (TiOx), and/or the like.

The gate electrode 170 may be disposed on a portion of the gateinsulation layer 150 under which the active layer 130 may be located.The gate electrode 170 may include a metal, a metal alloy, metalnitride, conductive metal oxide, transparent conductive materials, andso on. For example, the gate electrode 170 may include gold (Au), analloy of gold, silver (Ag), an alloy of silver, aluminum (Al), an alloyof aluminum, aluminum nitride (AlNx), tungsten (W), tungsten nitride(WNx), copper (Cu), an alloy of copper, nickel (Ni), chrome (Cr), chromenitride (CrNx), molybdenum (Mo), an alloy of molybdenum, titanium (Ti),titanium nitride (TiNx), platinum (Pt), tantalum (Ta), tantalum nitride(TaNx), neodymium (Nd), scandium (Sc), strontium ruthenium oxide (SRO),zinc oxide (ZnOx), stannum oxide (SnOx), indium oxide (InOx), galliumoxide (GaOx), indium tin oxide (ITO), indium zinc oxide (IZO), and/orthe like. These may be used alone or in a suitable combination thereof.The gate electrode 170 may have a multi-layered or single layeredstructure.

The insulating interlayer 190 may be disposed on the gate electrode 170.The insulating interlayer 190 may cover the gate electrode 170, and maybe disposed on the gate insulation layer 150. For example, theinsulating interlayer 190 may sufficiently cover the gate electrode 170on the gate insulation layer 150, and may have a substantially levelsurface without a step around the gate electrode 170. Alternatively, theinsulating interlayer 190 may cover the gate electrode 170 on the gateinsulation layer 150, and may be disposed as a substantially uniformthickness along a profile of the gate electrode 170. The insulatinginterlayer 190 may expose an upper surface of the substrate 110; and,the upper surface of the substrate 110 may be located in a portion ofthe peripheral region 40, the bending region 50, and a portion of padelectrode region 60. In addition, a width, extending in the seconddirection D2, of an opening defined by the gate insulation layer 150 andthe insulating interlayer 190 that expose an upper surface of thedisplay panel 200 may be greater than a with extending the seconddirection D2 of an opening defined by the lower protection film 300 thatexposes a lower surface of the display panel 200. The insulatinginterlayer 190 may include a silicon compound, a metal oxide, and so on.

The source electrode 210 and the drain electrode 230 may be disposed onthe insulating interlayer 190. The source electrode 210 may be in directcontact with a first side of the active layer 130 via a contact holeformed by removing a portion of the gate insulation layer 150 and theinsulating interlayer 190. The drain electrode 230 may be in directcontact with a second side of the active layer 130 via a contact holeformed by removing another portion of the gate insulation layer 150 andthe insulating interlayer 190. The source electrode 210 and the drainelectrode 230 may include a metal, an alloy, metal nitride, conductivemetal oxide, transparent conductive materials, and/or the like. Thesemay be used alone or in a suitable combination thereof. Each of thesource and drain electrodes 210 and 230 may have a multi-layeredstructure. Accordingly, the semiconductor element 250 including theactive layer 130, the gate insulation layer 150, the gate electrode 170,the insulating interlayer 190, the source electrode 210, and the drainelectrode 230 may be disposed.

The semiconductor element 250 may or might not have a top gatestructure. Likewise, the semiconductor element 250 may or might not havea bottom gate structure.

As illustrated in FIG. 4B, a first conductive pattern 172 may bedisposed in the peripheral region 40 on the gate insulation layer 150.As described above, the first conductive pattern 172 may be one among aplurality of the wirings. For example, the first conductive pattern 172may include a data signal wiring, a scan signal wiring, a light emissionsignal wiring, a power supply wiring, and so on.

A second conductive pattern 174 may be disposed in the pad electroderegion 60 on the gate insulation layer 150. The second conductivepattern 174 may be electrically connected to the pad electrode 470.

A connection electrode 212 may be disposed in a portion of theperipheral region 40, the bending region 50, and the a portion of thepad electrode region 60 on the insulating interlayer 190 to overlap thefirst conductive pattern 172 and the second conductive pattern 174. Theconnection electrode 212 may be in contact with the first conductivepattern 172 via a contact hole formed by removing a portion of theinsulating interlayer 190 located in the peripheral region 40, and maybe in contact with the second conductive pattern 174 via a contact holeformed by removing a portion of the insulating interlayer 190 located inthe pad electrode region 60. The first conductive pattern 172, thesecond conductive pattern 174, and the gate electrode 170 may besimultaneously (i.e., concurrently) formed using the same material. Inaddition, the connection electrode 212, the source electrode 210, andthe drain electrode 230 may be simultaneously formed using the samematerial.

Accordingly, an external device 101 and the OLED device 100 may beelectrically connected through the pad electrode 470 and a FPCB, and theexternal device 101 may provide a data signal, a scan signal, a lightemission signal, a power supply voltage, and so on, to the pixelsthrough the second conductive pattern 174, the connection electrode 212,and the first conductive pattern 172.

Referring again to FIGS, 4A and 4B, the planarization layer 270 may bedisposed on the connection electrode 212, the source electrode 210, andthe drain electrode 230. The planarization layer 270 may cover theconnection electrode 212, the source electrode 210, and the drainelectrode 230, and may be disposed on a part of or the entire insulatinginterlayer 190. The planarization layer 270 may be formed with athickness sufficient to cover at least a portion of the connectionelectrode 212 and the source and drain electrodes 210 and 230. Theplanarization layer 270 may have a substantially flat upper surface;and, a planarization process may be further performed on theplanarization layer 270 to obtain the flat upper surface of theplanarization layer 270. Alternatively, the planarization layer 270 maycover the connection electrode 212 and the source and drain electrodes210 and 230, and may be disposed as a substantially uniform thicknessalong a profile of the connection electrode 212 and the source and drainelectrodes 210 and 230. The planarization layer 270 may include organicmaterials and/or inorganic materials. Thus, in some embodiments theplanarization layer 270 may include only organic materials.

The lower electrode 290 may be disposed on the planarization layer 270.The lower electrode 290 may be in contact with the drain electrode 230via a contact hole formed by removing a portion of the planarizationlayer 270. In addition, the lower electrode 290 may be electricallyconnected to the semiconductor element 250. The lower electrode 290 mayinclude a metal, a metal alloy, metal nitride, conductive metal oxide,transparent conductive materials, and so on. These may be used alone orin a suitable combination thereof. The lower electrode 290 may or mightnot have a multi-layered structure.

The pixel defining layer 310 may be disposed on the planarization layer270 and may expose a portion of the lower electrode 290. The lightemitting layer 330 may be disposed on the portion of the lower electrode290 exposed by the pixel defining layer 310. The pixel defining layer310 may expose the bending region 50 and the pad electrode region 60.The pixel defining layer 310 may include organic materials and/orinorganic materials. Thus, in some embodiments, the pixel defining layer310 may include only organic materials.

The light emitting layer 330 may be disposed in a portion where theportion of the lower electrode 290 is exposed. The light emitting layer330 may be formed using at least one of certain light emitting materialscapable of generating different colors of light (e.g., a red color oflight, a blue color of light, a green color of light, and so on)according to sub-pixels. Alternatively, the light emitting layer 330 maygenerate a generally white color of light by stacking a plurality oflight emitting materials capable of generating different colors of lightsuch as a red color of light, a green color of light, a blue color oflight, and so on. A color filter may be disposed on the light emittinglayer 330. The color filter may be selected from a red color filter, agreen color filter, and a blue color filter. Alternatively, the colorfilter may include a yellow color filter, a cyan color filter, and amagenta color filter. The color filter may include a photosensitiveresin (or color photoresist), and so on.

The upper electrode 340 may be disposed on the pixel defining layer 310and the light emitting layer 330. The upper electrode 340 may include ametal, a metal alloy, metal nitride, conductive metal oxide, transparentconductive materials, and so on.

The TFE structure 450 may be disposed on the upper electrode 340. TheTFE structure 450 may include the first TFE layer 451, the second TFElayer 452, and the third TFE layer 453. The second TFE layer 452 may bedisposed on the first TFE layer 451; and, the third TFE layer 453 may bedisposed on the second TFE layer 452. The first TFE layer 451 may bedisposed on the upper electrode 340. The first TFE layer 451 may coverthe upper electrode 340, and may be disposed as a substantially uniformthickness along a profile of the upper electrode 340. The first TFElayer 451 may prevent the light emitting structure from beingdeteriorated by the permeation thereto of moisture, water, oxygen, andso on. In addition, the first TFE layer 451 may protect the lightemitting structure from damage caused by an external impact. The firstTFE layer 451 may or might not include inorganic materials.

The second TFE layer 452 may be disposed on the first TFE layer 451. Thesecond TFE layer 452 may improve the flatness of the OLED device 100 andmay protect the light emitting structure. The second TFE layer 452 mayor might not include organic materials.

The third TFE layer 453 may be disposed on the second TFE layer 452. Thethird TFE layer 453 may cover the second TFE layer 452 and may bedisposed as a substantially uniform thickness along a profile of thesecond TFE layer 452. The third TFE layer 453 together with the firstTFE layer 451 and the second TFE layer 452 may prevent the lightemitting structure from being deteriorated by the permeation thereto ofmoisture, water, oxygen, and so on. In addition, the third TFE layer 453together with the first TFE layer 451 and the second TFE layer 452 mayprotect the light emitting structure from damage caused by an externalimpact. The third TFE layer 453 may or might not include inorganicmaterials. Accordingly, the TFE structure 450 including the first TFElayer 451, the second TFE layer 452, and the third TFE layer 453 may bedisposed. In addition, the display panel 200 including the substrate110, the semiconductor element 250, the planarization layer 270, thelower electrode 290, the pixel defining layer 310, the light emittinglayer 330, the upper electrode 340, and the TFE structure 450 may bedisposed.

Alternatively, the TFE structure 450 may have a five layer structurewhere the first to fifth TFE layers may be stacked, or a seven layerstructure where the first to seventh TFE layers may be stacked.

The touch screen electrode layer 410 may be disposed on the TFEstructure 450 (or the display panel 200). The touch screen electrodelayer 410 may include a bottom polyethylene terephthalate (PET) film,touch screen electrodes, and a top PET film, and so on. The bottom PETfilm and/or the top PET film may protect the touch screen electrodes.For example, the top PET film and the bottom PET film may includepolyethylene terephthalate (PET), polyethylene naphthalate (PEN),polypropylene (PP), polycarbonate (PC), polystyrene (PS), polysulfone(PSul), polyethyene (PE), polyphthalamide (PPA), polyethersulfone (PES),polyarylate (PAR), polycarbonate oxide (PCO), modified polyphenyleneoxide (MPPO), and so on. The touch screen electrodes may have asubstantially metal mesh structure. For example, the touch screenelectrodes may include carbon nanotube (CNT), transparent conductiveoxide (TCO), indium tin oxide (ITO), indium gallium zinc oxide (IGZO),zinc oxide (ZnO), graphene, silver nanowire (AgNW), copper (Cu), chrome(Cr), and so on. Alternatively, the touch screen electrodes may bedisposed directly on the TFE structure 450. The bottom PET film may ormight not be disposed on the TFE structure 450.

The polarizing layer 430 may be disposed on the touch screen electrodelayer 410. The polarizing layer 430 may include a linearly polarizedfilm and a λ/4 phase retardation film. Here, the λ/4 phase retardationfilm may be disposed on the touch screen electrode layer 410. The λ/4phase retardation film may convert a phase of the light. For example,the λ/4 phase retardation film may convert the light vibrating up anddown or the light vibrating left and right into right-circularlypolarized light or left-circularly polarized light, respectively. Inaddition, the λ/4 phase retardation film may convert theright-circularly polarized light or the left-circularly polarized lightinto the light vibrating up and down or the light vibrating left andright, respectively. The λ/4 phase retardation film may include abirefringent film containing polymer, an orientation film of a liquidcrystal polymer, an alignment layer of a liquid crystal polymer, and soon.

The linearly polarized film may be disposed on the λ/4 phase retardationfilm. The linearly polarized film may selectively transmit the incidentlight. For example, the linearly polarized film may transmit the lightvibrating up and down or vibrating left and right. The linearlypolarized film may include a pattern of horizontal stripes or verticalstripes. When the linearly polarized film includes a pattern ofhorizontal stripes, the linearly polarized film may block the lightvibrating up and down, and may transmit the light vibrating left andright. When the linearly polarized film includes a pattern of verticalstripes, the linearly polarized film may block the light vibrating leftand right, and may transmit the light vibrating up and down.

The light transmitted from the linearly polarized film may also betransmitted from the λ/4 phase retardation film. As described above, theλ/4 phase retardation film may convert a phase of the light. Forexample, when the incident light vibrating up, down, left, and rightpasses through the linearly polarized film, the linearly polarized filmincluding a pattern of the horizontal stripes may transmit the lightvibrating left and right. When the incident light vibrating left andright passes through the λ/4 phase retardation film, the incident lightvibrating s left and right may be converted into the left-circularlypolarized light. The incident light including the left-circularlypolarized light may be reflected at the cathode electrode (e.g., theupper electrode 340) of the display panel 200, and then the incidentlight may be converted into the right-circularly polarized light. Whenthe incident light including the right-circularly polarized light passesthrough the λ/4 phase retardation film, the incident light may beconverted into the light vibrating up and down. Here, the lightvibrating up and down may be blocked by the linearly polarized filmincluding the pattern of horizontal stripes. Accordingly, the incidentlight may or might not be entirely removed by the linearly polarizedfilm and the λ/4 phase retardation film (i.e., the polarizing layer430). The linearly polarized film may include iodine-based materials,materials containing dye, polyene-based materials, and so on.Accordingly, the is upper structure 400 including the touch screenelectrode layer 410 and the polarizing layer 430 may be disposed.

As illustrated in FIG. 4B, the bending protection layer 460 may bedisposed in the peripheral region 40, the bending region 50, and aportion of the pad electrode region 60 on the planarization layer 270.The bending protection layer 460 may protect the connection electrode212, and may rise in a direction which may be opposite to the thirddirection D3, a neutral plane of the bending region 50. For example,when the bending region 50 is bent, the connection electrodes might notbe broken because the neutral plane of the bending region 50 may belocated within a portion where the connection electrodes are disposed.The bending protection layer 460 may or might not include organicmaterials.

Referring again to FIGS. 4A and 4B, the lower protection film 300 may bedisposed in a lower surface of the substrate 110. The lower protectionfilm 300 may protect the display panel 200 from damage caused by anexternal impact.

The lower protection film 300 may include the first lower protectionfilm pattern 351 and the second lower protection film pattern 352. Thefirst lower protection film pattern 351 may be partially or entirelydisposed in the display region 10, and the second lower protection filmpattern 352 may be disposed only in the pad electrode region 60 suchthat a lower surface of the display panel 200 located in the bendingregion 50 may be exposed. In other words, the lower protection film 300may expose a lower surface of the display panel 200 in the bendingregion 50, and the first lower protection film pattern 351 may be spacedapart from the second lower protection film pattern 352. The spacedapart portion may be an opening defined by the lower protection film300, and a width extending in the second direction D2 of the openingdefined by the lower protection film 300 may be less than a widthextending in the second direction D2 of an opening defined by the gateinsulation layer 150 and the insulating interlayer 190 that expose anupper surface of the display panel 200. The first adhesive layer 302 andthe second adhesive layer 304 may be in direct contact with a lowersurface of the display panel 200. For example, the first and secondadhesive layers 302 and 304 may include optical clear adhesives (OCA),pressure sensitive adhesives (PSA), and so on, including acryl-basedadhesives, silicon-based adhesives, urethane-based adhesives,rubber-based adhesives, vinyl ether-based adhesives, and the like. Inaddition, an antistatic material may be added in the OCA or the PSA.Further, each of the first protection layer 301 and the first adhesivelayer 302 may be disposed under the first adhesive layer 302 and thesecond adhesive layer 304, respectively. For example, each of the firstprotection layer 301 and the second protection layer 303 may includePET, PEN, PP, PC, PS, PSul, PE, PPA, PES, PAR, PCO, MPPO, and so on.

In a process where the lower protection film 300 is attached to a lowersurface of the display panel 200, a release film may be disposed on thelower protection film 300 to protect the first adhesive layer 302 andthe second adhesive layer 304. Static electricity may be non-uniformlydistributed in the first adhesive layer 302 and the second adhesivelayer 304 by a process where the release film is detached from the lowerprotection film 300. In other words, electric charges located in therelease film may migrate to the first adhesive layer 302 and the secondadhesive layer 304 when the release film is detached from the lowerprotection film 300; to and, a relatively large amount of electriccharges may be distributed at a portion (e.g., a distal end portion ofthe lower protection film 300) where the release film is finally (orlastly) detached from the lower protection film 300. An image displayedby the OLED device 100 may be degraded by the non-uniform distributionof the electric charges. In particular, a luminance of light emittedfrom the display panel 200 may be undesirably high in a portion havingthe non-uniform distribution of the electric charges.

When the first adhesive layer 302 and the second adhesive layer 304include the antistatic material, a surface resistance of the first andsecond adhesive layers 302 and 304 may be decreased. For example, whenthe first and second adhesive layers 302 and 304 do not include theantistatic material, the surface resistance of the first and secondadhesive layers 302 and 304 may be greater than about 1×10¹³ ohm/sq. Incontrast, when the first and second adhesive layers 302 and 304 includethe antistatic material, a surface resistance of the first and secondadhesive layers 302 and 304 may be less than about 1×10¹¹ ohm/sq. Aweight ratio the antistatic material based on a total weight of thefirst and second adhesive layers 302 and 304 may be in a range betweenabout 1 wt % and about 3 wt % (of the total weight). Thus, the electriccharges may achieve a uniform distribution in the first and secondadhesive layers 302 and 304 having a low surface resistance and/or maymigrate to a grounded process device. Accordingly, the performance ofthe OLED device 100 may be improved by reducing or eliminating theproblems associated with the presence of static electricity as describedin greater detail elsewhere herein.

The thickness of the lower protection film 300 may be in a range betweenabout 85 and about 91 micrometers. the thickness of each of the firstand second protection layers 301 and 302 may be in a range between about74 and about 76 micrometers; and, the thickness of the first and secondadhesive layers 302 and 304 may be in a range between about 11 and about13 micrometers. As illustrated in FIGS. 2A and 2B, the display region 10may include the second sub-display region 32 and the third sub-displayregion 33 that have a shape which is bent on an axis with respect withthe second direction D2. A neutral plane of the lower protection film300, the display panel 200, and the upper structure 400 in the secondand third sub-display regions 32 and 33 may be located within thedisplay panel 200. That is, the thickness of the lower protection film300 may be determined such that the neutral plane in the second andthird sub-display regions 32 and 33 is located within the display panel200. For example, when the second and third sub-display regions 32 and33 are bent, the display panel 200 might not be damaged because theneutral plane of the second and third sub-display regions 32 and 33 islocated within the display panel 200.

The antistatic material included in the first and second adhesive layers302 and 304 may include carbon nanotube, graphene, metal oxide,conductive polymer, and similar materials. The metal oxide may includezinc oxide (ZnO), antimony tin oxide (ATO), indium tin oxide (ITO), andthe like. In addition, the conductive polymer may include polyfluorene,polyphenylene, polypyrene, polyazulene, polynaphthalene, polyacetylene(PAC), poly-p-phenylene vinyl (PPV), polypyrrole (PPY), polycarbazole,polyindole, polyzepine, poly (thienylene vinylene), polythiophene,Polyaniline (PANT), poly (thiophene), poly (p-phenylene sulfide), poly(3,4-ethylenedioxythiophene) (3,4-ethylenedioxythiophene) (PEDOT), poly(3,4-ethylenedioxythiophene) (PEDOT: PSS) doped with poly(styrenesulfonate)-tetramethacrylate (PEDOT-TMA), polyfuran, and similarmaterials. These materials may be used alone or in a suitablecombination thereof.

As will be described in greater detail below, the OLED device 100 mayinclude the first and second adhesive layers 302 and 304, including anantistatic material; and, the OLED device 100 may be protected fromstatic electricity generated due to a detachment of a release film fromthe lower protection film 300. In addition, as the thickness of thelower protection film 300 is known, the neutral plane of the displaypanel 200 and the upper structure 400 in the second and thirdsub-display regions 32 and 33 of the display panel 200 having a bentshape may be located within the display panel 200. Accordingly, althougha portion of the display region 10 may be bent, the display panel 200might not be damaged due to the inclusion of the neutral plane withinthe display panel 200.

Referring to exemplary method stages shown in FIGS. 5A, 5B, and 5C, adisplay panel 200, a lower film 105 disposed on a lower surface of thedisplay panel 200, a touch screen electrode layer 410 disposed in alight emitting region 30 on the display panel 200, and an upper film 107disposed on the display panel 200 may be provided. For example, when amother substrate including a plurality of display panels is cut by acell cutting process, the upper film 107 may be disposed to protect anupper surface of the display panels and the lower film 105 may bedisposed to protect a lower surface of the mother substrate. FIG. 5Aillustrates a preliminary OLED device 100 after the cell cutting and padcutting.

As illustrated in FIGS. 5B and 5C, a substrate 110 including transparentmaterials may be located on the lower film 105. The substrate 110 may beformed using a flexible transparent material such as a flexibletransparent resin substrate (e.g., a polyimide substrate).

A buffer layer may be formed on the substrate 110. The buffer layer maybe formed on a part of or the entire substrate 110. The buffer layer mayprevent the diffusion of metal atoms and/or impurities from thesubstrate 110 into the semiconductor element 250. Additionally, thebuffer layer may control a rate of a heat transfer in a crystallizationprocess for forming the active layer 130, thereby obtaining asubstantially uniform active layer 130.

Furthermore, the buffer layer may improve a surface flatness of thesubstrate 110 when a surface of the substrate 110 is relativelyirregular. The buffer layer may be formed using a silicon compound, ametal oxide, and similar materials.

An active layer 130 may be formed on the substrate 110, and the activelayer 130 may be formed using an oxide semiconductor, an inorganicsemiconductor, an organic semiconductor, and similar materials.

A gate insulation layer 150 may be formed on the active layer 130. Thegate insulation layer 150 may cover the active layer 130, and may beformed on the substrate 110. In addition, the gate insulation layer 150may include an opening that exposes an upper surface of the substrate110 in a bending region 50. The gate insulation layer 150 may be formedusing silicon compound, metal oxide, and similar materials.

A gate electrode 170 may be formed on a portion of the gate insulationlayer 150 under which the active layer 130 may be located. The gateelectrode 170 may be formed using a metal, a metal alloy, metal nitride,a conductive metal oxide, transparent conductive materials, and similarmaterials.

A first conductive pattern 172 may be formed in a peripheral region 40on the gate insulation layer 150. The first conductive pattern 172 mayinclude a data signal wiring, a scan signal wiring, a light emissionsignal wiring, a power supply wiring, and other components.

A second conductive pattern 174 may be formed in the pad electroderegion 60 on the gate insulation layer 150. The second conductivepattern 174 may be electrically connected to a pad electrode 470. Thefirst conductive pattern 172, the second conductive pattern 174, and thegate electrode 170 may be simultaneously formed using the same material.

An insulating interlayer 190 may be formed on the gate electrode 170,the first conductive pattern 172 and the second conductive pattern 174.The insulating interlayer 190 may cover the gate electrode 170, thefirst conductive pattern 172 and the second conductive pattern 174, andmay be formed on the gate insulation layer 150. In addition, theinsulating interlayer 190 may include an opening that exposes an uppersurface of the substrate 110 in the bending region 50. The insulatinginterlayer 190 may be formed using a silicon compound, a metal oxide,and similar materials.

A source electrode 210 and a drain electrode 230 may be formed on theinsulating interlayer 190. The source electrode 210 may be in directcontact with a first side of the active layer 130 via a contact holeformed by removing a portion of the gate insulation layer 150 and theinsulating interlayer 190. The drain electrode 230 may be in directcontact with a second side of the active layer 130 via a contact holeformed by removing another portion of the gate insulation layer 150 andthe insulating interlayer 190. The source electrode 210 and the drainelectrode 230 may be formed using a metal, an alloy, a metal nitride, aconductive metal oxide, transparent conductive materials, and similarmaterials. These may be used alone or in a suitable combination thereof.Each of the source and drain electrodes 210 and 230 may or might nothave a multi-layered structure. Accordingly, a semiconductor element 250including the active layer 130, the gate insulation layer 150, the gateelectrode 170, the insulating interlayer 190, the source electrode 210,and the drain electrode 230 may be formed.

A connection electrode 212 may be formed in a portion of the peripheralregion 40, the bending region 50, and the a portion of the pad electroderegion 60 on the insulating interlayer 190 to overlap the firstconductive pattern 172 and the second conductive pattern 174. Theconnection electrode 212 may be in contact with the first conductivepattern 172 via a contact hole formed by removing a portion of theinsulating interlayer 190 located in the peripheral region 40, and maybe in contact with the second conductive pattern 174 via a contact holeformed by removing a portion of the insulating interlayer 190 located inthe pad electrode region 60. The connection electrode 212, the sourceelectrode 210, and the drain electrode 230 may be simultaneously formedusing the same material.

A planarization layer 270 may be formed on the connection electrode 212,the source electrode 210, and the drain electrode 230. The planarizationlayer 270 may cover the connection electrode 212, the source electrode210, and the drain electrode 230, and may be formed on a part of or theentire insulating interlayer 190. The planarization layer 270 may beformed with a thickness sufficient to cover the connection electrode 212and the source and drain electrodes 210 and 230. The planarization layer270 may have a substantially flat upper surface; and, a planarizationprocess may be further performed on the planarization layer 270 toobtain a flat upper surface of the planarization layer 270. Theplanarization layer 270 may or might not be formed using organicmaterials.

A lower electrode 290 may be formed on the planarization layer 270. Thelower electrode 290 may be in contact with the drain electrode 230 via acontact hole formed by removing a portion of the planarization layer270. The lower electrode 290 may be formed using a metal, a metal alloy,a metal nitride, a conductive metal oxide, transparent conductivematerials, and similar materials. These may be used alone or in asuitable combination thereof. The lower electrode 290 may or might nothave a multi-layered structure.

A pixel defining layer 310 may be formed on the planarization layer 270,and may expose a portion of the lower electrode 290. The pixel defininglayer 310 may expose the bending region 50 and the pad electrode region60. The pixel defining layer 310 may or might not be formed usingorganic materials.

A light emitting layer 330 may be formed in an area corresponding towhere the portion of the lower electrode 290 may be exposed. The lightemitting layer 330 may be formed using at least one of light emittingmaterials capable of generating different colors of light (e.g., a redcolor, a blue color, and a green color, and so on) according tosub-pixels. Alternatively, the light emitting layer 330 may generate agenerally white color of light by stacking a plurality of light emittingmaterials capable of generating different colors of light such as a redcolor, a green color, a blue color, and so on. A color filter may bedisposed on the light emitting layer 330. The color filter may includeat least one selected from a red color filter, a green color filter, anda blue color filter. Alternatively, the color filter may include ayellow color filter, a cyan color filter, and a magenta color filter.The color filter may be formed using a photosensitive resin (or colorphotoresist), etc.

An upper electrode 340 may be formed on the pixel defining layer 310 andthe light emitting layer 330. The upper electrode 340 may be formedusing a metal, a metal alloy, a metal nitride, a conductive metal oxide,transparent conductive materials, and similar materials.

A first TFE layer 451 may be formed on the upper electrode 340. Thefirst TFE layer 451 may cover the upper electrode 340, and may be formedwith a substantially uniform thickness along a profile of the upperelectrode 340. The first TFE layer 451 may prevent a light s emittingstructure (e.g., the semiconductor element 250, the lower electrode 290,the light emitting layer 330, the upper electrode 340, and so on) frombeing deteriorated by the permeation of moisture, water, oxygen, and soforth. In addition, the first TFE layer 451 may protect the lightemitting structure from damage caused by an external impact. The firstTFE layer 451 may or might not be formed using one or more inorganicmaterials.

A second TFE layer 452 may be formed on the first TFE layer 451. Thesecond TFE layer 452 may improve the flatness of an OLED device 100, andmay protect the light emitting structure. The second TFE layer 452 maybe formed using organic materials.

A third TFE layer 453 may be formed on the second TFE layer 452. Thethird TFE layer 453 may cover the second TFE layer 452, and may beformed with a substantially uniform thickness along a profile of thesecond TFE layer 452. The third TFE layer 453 together with the firstTFE layer 451 and the second TFE layer 452 may prevent the lightemitting structure from being deteriorated by the permeation thereto ofmoisture, water, oxygen, and similar materials. In addition, the thirdTFE layer 453 together with the first TFE layer 451 and the second TFElayer 452 may protect the light emitting structure from damage caused byan external impact. The third TFE layer 453 may or might not be formedusing inorganic materials. Accordingly, a TFE structure 450 includingthe first TFE layer 451, the second TFE layer 452, and the third TFElayer 453 may be formed. In addition, a display panel 200 including thesubstrate 110, the semiconductor element 250, the planarization layer270, the lower electrode 290, the pixel defining layer 310, the lightemitting layer 330, the upper electrode 340, and the TFE structure 450may be formed.

A touch screen electrode layer 410 may be formed on the TFE structure450 (or the display panel 200). The touch screen electrode layer 410 mayinclude a bottom PET film, touch screen electrodes, a top PET film, andsimilar materials. The bottom PET film and/or the top PET film mayprotect the touch screen electrodes. The touch screen electrodes mayhave a substantially metal mesh structure. Alternatively, the touchscreen electrodes may be formed directly on the TFE structure 450. Thus,the bottom PET film might not be formed on the TFE structure 450.

Referring to FIG. 6, a lower protection film 300, a release film 530disposed on the lower protection film 300, and a carrier film 510disposed a lower surface of the lower protection film 300 may beprovided. The lower protection film 300 may protect a lower surface ofthe display panel 200; and, the release film 530 may protect an adhesivelayer (e.g., first and second adhesive layers 302 and 304) of the lowerprotection film 300. In addition, the carrier film 510 may support thelower protection film 300.

The lower protection film 300 may include a first lower protection filmpattern 351 and a second lower protection film pattern 352. The firstlower protection film pattern 351 may include a first protection layer301 and a first adhesive layer 302; and, the second lower protectionfilm pattern 352 may include a second protection layer 303 and a secondadhesive layer 304. The release film 530 may include a PET film wheresilicon is laminated in a surface of the PET film; and, the carrier film510 may include an adhesive layer 511 including an antistatic materialand a PET film 512. An adhesive force of the adhesive layer 511 may beless than that of the first and second adhesive layers 302 and 304.

Referring to FIG. 7, after the lower film 105 located on a lower surfaceof the display panel 200 is removed from the display panel 200, thelower protection film 300 and the carrier film 510 may be formed on alower surface of the display panel 200 by removing the release film 530on the lower protection film 300.

The first lower protection film pattern 351 of the lower protection film300 may be formed in the display region 10; and, the second lowerprotection film pattern 352 may be formed in the pad electrode region 60such that a lower surface of the display panel 200 located in thebending region 50 is exposed. In other words, the lower protection film300 may expose a lower surface of the display panel 200 in the bendingregion 50; and, the first lower protection film pattern 351 may bespaced apart from the second lower protection film pattern 352. Inaddition, the first adhesive layer 302 and the second adhesive layer 304may be in direct contact with a lower surface of the display panel 200,and may include an antistatic material. Further, each of the firstprotection layer 301 and the first adhesive layer 302 may be locatedunder the first adhesive layer 302 and the second adhesive layer 304,respectively. For example, the first and second adhesive layers 302 and304 may be formed using the OCA, the PSA, and similar materials,including acryl-based adhesives, silicon-based adhesives, urethane-basedadhesives, rubber-based adhesives, vinyl ether-based adhesives, and thelike. In addition, an antistatic material may be added in the OCA or thePSA. Further, each of the first protection layer 301 and the secondprotection layer 303 may be formed using PET, PEN, PP, PC, PS, PSul, PE,PPA, PES, PAR, PCO, MPPO, etc.

When the lower protection film 300 is attached to a lower surface of thedisplay panel 200, static electricity may be non-uniformly distributedin the first adhesive layer 302 and the second adhesive layer 304 whenthe release film 530 is detached from the lower protection film 300. Inother words, electric charges located in the release film 530 maymigrate to the first adhesive layer 302 and the second adhesive layer304 when the release film 530 is detached from the lower protection film300; and, a relatively large amount of electric charges may bedistributed at a portion (e.g., a distal end portion of the lowerprotection film 300) where the release film is detached from the lowerprotection film 300. An image displayed by the OLED device 100 may bedegraded by the non-uniform distribution of the electric charges. Inparticular, a luminance of a light emitted from the display panel 200may be undesirably high in a portion having the non-uniform distributionof the electric charges.

When the first adhesive layer 302 and the second adhesive layer 304include the antistatic material, a surface resistance of the first andsecond adhesive layers 302 and 304 may be decreased. For example, whenthe first and second adhesive layers 302 and 304 do not include theantistatic material, a surface resistance of the first and secondadhesive layers 302 and 304 may be greater than about 1×10¹³ ohm/sq. Incontrast, when the first and second adhesive layers 302 and 304 includethe antistatic material, a surface resistance of the first and secondadhesive layers 302 and 304 may be less than about 1×10¹¹ ohm/sq. Theweight ratio the antistatic material based on a total weight of thefirst and second adhesive layers 302 and 304 may be in a range betweenabout 1 wt % and about 3 wt % (of the total weight). Thus, the electriccharges may achieve a uniform distribution in the first and secondadhesive layers 302 and 304 having a low surface resistance and/or maymigrate to a grounded process device. Accordingly, the performance ofthe OLED device 100 may be improved as described herein.

The thickness of the lower protection film 300 may be in a range betweenabout 85 and about 91 micrometers. The thickness of each of the firstand second protection layers 301 and 302 may be in a range between about74 and about 76 micrometers; and, the thickness of the first and secondadhesive layers 302 and 304 may be in a range between about 11 and about13 micrometers. As illustrated in FIGS. 2A and 2B, the display region 10may include the second sub-display region 32 and the third sub-displayregion 33 that have a shape which is bent on an axis with respect withthe second direction D2. The neutral plane of the lower protection film300, the display panel 200, and the upper structure 400 in the secondand third sub-display regions 32 and 33 may be located within thedisplay panel 200. That is, a thickness of the lower protection film 300may be determined such that the neutral plane in the second and thirdsub-display regions 32 and 33 is located within the display panel 200.For example, when the second and third sub-display regions 32 and 33 arebent, the display panel 200 might not be damaged because a neutral planeof the second and third sub-display regions 32 and 33 is located withinthe display panel 200.

The antistatic material included in the first and second adhesive layers302 and 304 may include a carbon nanotube, a graphene, a metal oxide, aconductive polymer, and similar materials. The metal oxide may includeZnO, ATO, ITO, etc. In addition, the conductive polymer may includepolyfluorene, polyphenylene, polypyrene, polyazulene, polynaphthalene,PAC, PPV, PPY, polycarbazole, polyindole, polyzepine, poly (thienylenevinylene), polythiophene, PANI, poly (thiophene), poly (p-phenylenesulfide), PEDOT, PEDOT:PSS doped with PEDOT-TMA, polyfuran, or the like.These may be used alone or in a suitable combination thereof.

Referring FIG. 8, the upper film 107 may be removed on the display panel200, and a polarizing layer 430 may be formed on the touch screenelectrode layer 410. Accordingly, an upper structure 400 including thetouch screen electrode layer 410 and the polarizing layer 430 may beformed. In addition, the carrier film 510 may be removed on a lowersurface of the lower protection film 300. Accordingly, the OLED device100 of FIG. 3A may be manufactured.

An OLED device 600 illustrated in FIG. 9 may have a configurationsubstantially the same as, or similar to, that of the OLED device 100described with reference to FIGS. 1 to 4B. In FIG. 9, detaileddescriptions for elements that are substantially the same as, or similarto, elements described above with reference to FIGS. 1 to 4B may not berepeated.

Referring to FIG. 9, an OLED device 600 may include a display panel 200,a lower protection film 300, an upper structure 400, a bendingprotection layer 460, a pad electrode 470, and other components. Thelower protection film 300 may include a first lower protection filmpattern 351 and a second lower protection film pattern 352. In addition,the first lower protection film pattern 351 may include a firstprotection layer 301 and a first adhesive layer 302; and, the secondlower protection film pattern 352 may include a second protection layer303 and a second adhesive layer 304. Further, the upper structure 400may include a polarizing layer 430 and a touch screen electrode layer410.

As described above, the display panel 200 may have a display region 10and a pad region 20. The display region 10 may include a light emittingregion 30 and a peripheral region 40, and the pad region 20 may includea bending region 50 and a pad electrode region 60.

The upper structure 400 may be disposed in the display region 10 on thedisplay panel 200. The polarizing layer 430 may be disposed on thedisplay panel 200; and, the touch screen electrode layer 410 may bedisposed on the polarizing layer 430.

The lower protection film 300 may be disposed on a lower surface of thedisplay panel 200. The lower protection film 300 may include the firstlower protection film pattern 351 that may be disposed in the displayregion 10 and the second lower protection film pattern 352 that may bedisposed in the pad electrode region 60 such that a lower surface of thedisplay panel 200 located in the bending region 50 may be exposed. Inother words, the lower protection film 300 may include an opening thatexposes a lower surface of the display panel 200 in the bending region50. In addition, the first adhesive layer 302 and the second adhesivelayer 304 may be in direct contact with a lower surface of the displaypanel 200, and may include antistatic materials.

Further, each of the first protection layer 301 and the secondprotection layer 303 may be disposed under the first adhesive layer 302and the second adhesive layer 304, respectively.

The first lower protection film pattern 351 may further include a lightblocking material. The light blocking material may be added to the firstprotection layer 301 and/or the first adhesive layer 302 of the firstlower protection film pattern 351. For example, the light blockingmaterial may include at least one of carbon black, titanium nitrideoxide, titanium black, phenylene black, aniline black, cyanine black,and nigrosine acid black.

After the OLED device 600 is manufactured, a black film may beadditionally disposed on a lower surface of the OLED device 600 (e.g., alower surface of the lower protection film 300). The black film mayprevent pixels P disposed in the inside of the display panel 200 frombeing visible to a user of the OLED device 600. When the first lowerprotection film pattern 351 includes the light blocking material, thefirst lower protection film pattern 351 may serve as the black film.Accordingly, a manufacturing cost of the OLED device 600 may be reducedbecause the black film might not need to be disposed on a lower surfaceof the OLED device 600.

An OLED device 700 illustrated in FIG. 10 may have a configurationsubstantially the same as, or similar to, that of an OLED device 100described with reference to FIGS. 1 to 4B except for the inclusion asecond adhesive layer 305. In FIG. 10, detailed descriptions forelements that are substantially the same as, or similar to, elementsdescribed above with reference to FIGS. 1 to 4B may not be repeated.

Referring to FIG. 10, an OLED device 700 may include a display panel200, a lower protection film 300, an upper structure 400, a bendingprotection layer 460, a pad electrode 470, and other components. Thelower protection film 300 may include a first lower protection filmpattern 351 and a second lower protection film pattern 352. In addition,the first lower protection film pattern 351 may include a firstprotection layer 301 and a first adhesive layer 302; and, the secondlower protection film pattern 352 may include a second protection layer303 and a second adhesive layer 305. Further, the upper structure 400may include a polarizing layer 430 and a touch screen electrode layer410.

The lower protection film 300 may be disposed on a lower surface of thedisplay panel 200. The lower protection film 300 may include the firstlower protection film pattern 351 disposed in the display region 10 andthe second lower protection film pattern 352 disposed in the padelectrode region 60 such that a lower surface of the display panel 200located in the bending region 50 is exposed. In other words, the lowerprotection film 300 may include an opening that exposes a lower surfaceof the display panel 200 in the bending region 50. In addition, thefirst adhesive layer 302 and the second adhesive layer 305 may be indirect contact with a lower surface of the display panel 200, and, insome embodiments, only the first adhesive layer 302 includes antistaticmaterials. That is, the second adhesive layer 305 might not include theantistatic material. Further, each of the first protection layer 301 andthe second protection layer 303 may be disposed under the first adhesivelayer 302 and the second adhesive layer 305, respectively.

When the lower protection film 300 is attached to a lower surface of thedisplay panel 200, a release film may be disposed on the lowerprotection film 300 to protect the first adhesive layer 302 and thesecond adhesive layer 305. Static electricity may be non-uniformlydistributed in the first adhesive layer 302 and the second adhesivelayer 305 as the release film is detached from the lower protection film300. In other words, electric charges located in the release film maymigrate to the first adhesive layer 302 and the second adhesive layer305 as the release film is detached from the lower protection film 300;and, a relatively large amount of electric charges may be distributed ata location where the release film is finally completely detached fromthe lower protection film 300. A displayed image of the OLED device 700may be degraded by the non-uniform distribution of the electric charges.In particular, a luminance of light emitted from the display panel 200may be undesirably high in a portion of the display having thenon-uniform distribution of the electric charges. Accordingly, because adefect in the performance of the OLED device 700 caused by thenon-uniform distribution of the electric charges does not occur in thepad electrode region 60 where the second adhesive layer 304 is disposed,the antistatic material may be omitted in the second adhesive layer 305.As a result, a process for adding the antistatic material in the secondadhesive layer 305 may also be omitted. Accordingly, the cost of thelower protection film 300 may be reduced because the antistatic materialmay be included in a portion of the lower protection film 300 ratherthan in the second adhesive layer 305, and the manufacturing cost of theOLED device 700 having the antistatic material may also be decreased.

An OLED device 800 illustrated in FIG. 11 may have a configurationsubstantially the same as or similar to that of an OLED device 100described with reference to FIGS. 1 to 4B except for the inclusion of anadhesive layer 306. In FIG. 11, detailed descriptions for elements thatare substantially the same as, or similar to, elements described withreference to FIGS. 1 to 4B may not be repeated.

Referring to FIG. 11, an OLED device 800 may include a display panel200, a lower protection film 300, an upper structure 400, a bendingprotection layer 460, a pad electrode 470, and other components. Thelower protection film 300 may include a first protection layer s 301, asecond protection layer 303, and an adhesive layer 306. Further, theupper structure 400 may include a polarizing layer 430 and a touchscreen electrode layer 410.

The lower protection film 300 may be disposed on a lower surface of thedisplay panel 200. The lower protection film 300 may define a groove inthe bending region 50.

The adhesive layer 306 may be partially or entirely disposed on a lowersurface of the display panel 200. The first protection layer 301 may bedisposed in the display region 10, and the second protection layer 303may be disposed in the pad electrode region 60 defining the groove therebetween such that a lower surface of the adhesive layer 306 located inthe bending region 50 is exposed in the groove. The first protectionlayer 301 and the second protection layer 303 may be spaced apart fromeach other on the adhesive layer 306 to define the groove there between.

When the lower protection film 300 is attached to a lower surface of thedisplay panel 200, the lower protection film 300 may be partially orentirely disposed on a lower surface of the display panel 200; and, aprotection layer removal pattern located in the bending region 50 may beremoved from the adhesive layer 306 before the bending region 50 isbent. To prevent impurities from penetrating an empty space definedbetween the first protection layer 301 and the second protection layer303 in a manufacturing process, the protection layer removal pattern maybe disposed on the adhesive layer 306, and the protection layer removalpattern may be removed before the bending region 50 is bent.Alternatively, in a process for removing the protection layer removalpattern, a portion of the adhesive layer 306 may be simultaneouslyremoved. That is, at least a portion of the adhesive layer 306 may bedisposed on a lower surface of the display panel 200 that is located inthe bending region 50.

An OLED device 900 illustrated in FIG. 12 may have a configurationsubstantially the same as, or similar to, that of the OLED device 100described with reference to

FIGS. 1 to 4B, except for the inclusion of an antistatic layer 307. InFIG. 12, detailed descriptions for elements that are substantially thesame as, or similar to, elements described with reference to FIGS. 1 to4B may not be repeated.

Referring to FIG. 12, an OLED device 900 may include a display panel200, a lower protection film 300, an upper structure 400, a bendingprotection layer 460, a pad electrode 470, and similar components. Thelower protection film 300 may include a first lower protection filmpattern 351, a second lower protection film pattern 352, and theantistatic layer 307. In addition, the first lower protection filmpattern 351 may include a first protection layer 301 and a firstadhesive layer 302; and, the second lower protection film pattern 352may include a second protection layer 303 and a second adhesive layer304. Further, the upper structure 400 may include a polarizing layer 430and a touch screen electrode layer 410.

The lower protection film 300 may be disposed on a lower surface of thedisplay panel 200. The lower protection film 300 may include the firstlower protection film pattern 351 that is disposed in the display region10, the second lower protection film pattern 352 that is disposed in thepad electrode region 60 such that a lower surface of the display panel200 located in the bending region 50 is exposed there between, and theantistatic layer 307 that is disposed under the first lower protectionfilm pattern 351 and the second lower protection film pattern 352. Inother words, an opening in the lower protection film 300 may expose alower surface of the display panel 200 in the bending region 50. Inaddition, the first adhesive layer 302 and the second adhesive layer 304may be in direct contact with a lower surface of the display panel 200,and may include antistatic materials. Further, each of the firstprotection layer 301 and the second protection layer 303 may be disposedunder the first adhesive layer 302 and the second adhesive layer 304,respectively. The antistatic layer 307 including an antistatic materialmay be disposed under the first protection layer 301 and under thesecond protection layer 303.

When a carrier film 510 is removed from the lower protection film 300,electric charges located in the carrier film 510 may migrate to theantistatic layer 307. These electric charges achieve a uniformdistribution in the antistatic layer 307 having a reduced surfaceresistance or may migrate to a grounded process device.

The inventive concepts described herein may be applied to variousdisplay devices including an organic light emitting display device. Forexample, the inventive concepts described herein may be applied to avehicle-display device, a ship-display device, an aircraft-displaydevice, portable communication devices, display devices for informationtransfer, a medical-display device, and similar devices.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of thepresented claims and various obvious modifications and equivalentarrangements.

What is claimed is:
 1. An organic light emitting display (OLED) device,comprising: a flexible display panel having a display region where aplurality of pixels are disposed and a pad region where pad electrodesthat are electrically connected to an external device are disposed, thepad region being located at a side of the display region, the displaypanel being configurable to have curved shape where a flexible portionof the display region is bent; an upper structure in the display regionof the display panel; and a lower protection film on a lower surface ofthe display panel, the lower protection film comprising: an adhesivelayer in direct contact with the lower surface of the display panel, theadhesive layer including an antistatic material; and a protection layerdisposed under the adhesive layer.
 2. The OLED device of claim 1,wherein the display region has a first width extending in a firstdirection, and the pad region has a second width extending in the firstdirection when viewed in a plan view of the OLED device, and wherein thesecond width is less than the first width.
 3. The OLED device of claim2, wherein the display region comprises: a first sub-display regionlocated in a center of the display region, the first sub-display regionhaving opposed lateral portions; second and third sub-display regions,with the second sub-display located at one of the opposed lateralportions of the first sub-display region and the third sub-displayregion located at the other opposed lateral portion, the second andthird sub-display regions being configured to have a shape that is benton an axis with respect to a second direction, the second directionbeing perpendicular to the first direction; a fourth sub-display regionlocated adjacent to the second sub-display region, the fourthsub-display region extending in a third direction that is orthogonal toboth the first direction and the second direction; and a fifthsub-display region located adjacent to the third sub-display region, thefifth sub-display region extending in the third direction.
 4. The OLEDdevice of claim 3, wherein the second and fourth sub-display regions andthe third and fifth sub-display regions are symmetrical to each otherwith respect to the first sub-display region.
 5. The OLED device ofclaim 3, wherein the display region comprises: a light emitting regionconfigured to emit light; and a peripheral region surrounding the lightemitting region, wherein the first sub-display region, the secondsub-display region, and the third sub-display region are located in thelight emitting region, and the fourth sub-display region and the fifthsub-display region are located in the peripheral region.
 6. The OLEDdevice of claim 5, wherein the lower protection film is disposed on aportion of the lower surface of the display panel that is located in thefirst, second, third, fourth, and fifth sub-display regions or onsubstantially the entire lower surface of the display panel that islocated in the first, second, third, fourth, and fifth sub-displayregions.
 7. The OLED device of claim 6, wherein a neutral plane of thelower protection film, the display panel, and the upper structure in thesecond and third sub-display regions are located within the displaypanel.
 8. The OLED device of claim 7, wherein a thickness of theadhesive layer of the lower protection film is in a range between about11 and about 15 micrometers, and a thickness of the protection layer ofthe lower protection film is in a range between about 74 and about 76micrometers.
 9. The OLED device of claim 5, wherein a plurality ofwirings is disposed in the peripheral region, and the plurality ofwirings electrically connect the pad electrodes and the pixels.
 10. TheOLED device of claim 2, wherein the pad region includes: a bendingregion located in a first portion of the pad region that is adjacent tothe display region; and a pad electrode region where the pad electrodesare disposed in a second portion of the pad region.
 11. The OLED deviceof claim 10, further comprising: a bending protection layer in a portionof the display region, the bending region, and a portion of the padelectrode region; and connection electrodes between the bendingprotection layer and the display panel, the connection electrodeselectrically connecting the pixels and the pad electrodes.
 12. The OLEDdevice of claim 10, wherein the lower protection film exposes a portionof the lower surface of the display panel that is located in the bendingregion.
 13. The OLED device of claim 12, wherein the lower protectionfilm includes: a first lower protection film pattern disposed in thedisplay region; and a second lower protection film pattern disposed inthe pad electrode region of the pad region such that the portion of thelower surface of the display panel that is located in the bending regionis exposed.
 14. The OLED device of claim 13, wherein the first lowerprotection film pattern and the second lower protection film pattern arespaced apart from each other.
 15. The OLED device of claim 13, whereinthe bending region is bent on an axis with respect to the firstdirection, and the second lower protection film pattern is disposed on alower surface of the first lower protection film pattern.
 16. The OLEDdevice of claim 15, wherein a bending radius of the bending region isless than a bending radius of a portion of the display region where thedisplay region is bent.
 17. The OLED device of claim 10, wherein thelower protection film defines a groove in the bending region.
 18. TheOLED device of claim 17, wherein the adhesive layer included in thelower protection film is entirely disposed on the lower surface of thedisplay panel, wherein the protection layer included in the lowerprotection film includes: a first protection layer disposed in thedisplay region; and a second protection layer disposed in the padregion, the first protection layer and the second protection layerdefining an opening exposing a lower surface of the adhesive layerlocated in the bending region, and wherein the first protection layerand the second protection layer are spaced apart from each other on thelower surface of the adhesive layer.
 19. The OLED device of claim 10,wherein each of the pixels included in the display panel includes: asubstrate on the lower protection film; a semiconductor element on thesubstrate; a lower electrode on the semiconductor element; a lightemitting layer on the lower electrode; an upper electrode on the lightemitting layer; and a thin film encapsulation structure on the upperelectrode.
 20. The OLED device of claim 19, wherein the semiconductorelement includes: an active layer on the substrate; a gate insulationlayer on the active layer; a gate electrode on the gate insulationlayer; an insulating interlayer on the gate electrode, the gateinsulation layer and the insulating interlayer defining an opening thatexposes an upper surface of the substrate that is located in the bendingregion; and source and drain electrodes on the insulating interlayer.21. The OLED device of claim 19, wherein the upper structure includes atouch screen electrode layer and a polarizing layer on the thin filmencapsulation structure.
 22. The OLED device of claim 21, wherein thepolarizing layer is disposed on the touch screen electrode layer. 23.The OLED device of claim 21, wherein the touch screen electrode layer isdisposed on the polarizing layer.
 24. The OLED device of claim 1,wherein the lower protection film further comprises an antistatic layerunder the protection layer.
 25. The OLED device of claim 24, wherein athickness of the protection layer is greater than a thickness of theadhesive layer, and the thickness of the adhesive layer is greater thana thickness of the antistatic layer.
 26. The OLED device of claim 1,wherein a surface resistance of an upper surface of the lower protectionfilm that is in direct contact with the display panel is less than about1×10¹¹ ohm/sq.
 27. The OLED device of claim 1, wherein a weight ratiothe antistatic material based on a total weight of the adhesive layer isin a range between about 1 wt % and about 3 wt %.
 28. The OLED device ofclaim 1, wherein the protection layer further includes a light blockingmaterial.
 29. The OLED device of claim 28, wherein the light blockingmaterial comprises at least one material selected from the groupconsisting of carbon black, titanium nitride oxide, titanium black,phenylene black, aniline black, cyanine black, and nigrosine acid black.30. The OLED device of claim 1, wherein the pad region has a width thatis less than a width of the display region.
 31. An organic lightemitting display (OLED) device, comprising: a display panel having adisplay region where a plurality of pixels are disposed and a pad regionwhere pad electrodes that are electrically connected to an externaldevice are disposed, the pad region located at a side of the displayregion, the display panel being configurable to have curved shape wherea flexible portion of the display region is bent; an upper structure inthe display region of the display panel; and a lower protection film ona lower surface of the display panel, the lower protection filmcomprising: an adhesive layer in direct contact with the lower surfaceof the display panel, the to adhesive layer including an antistaticmaterial; and a protection layer under the adhesive layer, wherein thepad region comprises: a bending region located in a first portion of thepad region that is adjacent to the display region; and is a padelectrode region where the pad electrodes are disposed in a secondportion of the pad region, wherein the lower protection film comprises:a first lower protection film pattern disposed in the display region;and a second lower protection film pattern disposed in the pad electroderegion of the pad region such that the portion of the lower surface ofthe display panel that is located in the bending region is exposed, andwherein the antistatic material is included in the first lowerprotection film pattern, and the second lower protection film patterndoes not include the antistatic material.